About BDAI 2020

Nov. 26-29, 2020 | Shenzhen, China

Call for Papers-征文主题

AI 人工智能

Machine Learning 机器学习

Big Data 大数据

Data Science 数据科学

Industry 4.0 & Robotics 工业4.0 &机器人

Publication-出版信息

All the registered and presented papers will be published in the Conference Proceeding , which will be submitted to EI Compendex, Scopus, Thomson Reuters (WoS), Inspec, and other indexing organizations for review and indexing.
所有提交的文章将送审会议组委会, 会议收录的文章将出版在会议论文集中,并提交EI Compendex, Scopus, Thomson Reuters (WoS), Inspec等其他检索机构审核和检索。

Submission Methods-投稿方式

Authors can submit manuscripts through electronic submission system or email. In order to avoid repeated submission, please just choose one submisson method. Please click following link:
作者可通过在线投稿系统或者邮箱投稿。避免重复投稿,请只选择一种方式 

Electronic Submission System

bdai@smehk.org

Peer Review Instructions-审核指南

All the papers will be peer reviewed by 2-3 experts. It takes 20-30 working days for the result coming out. If the paper needs revising, it should be resubmitted for peer review again.
所有投稿都将由2-3名专家进行同行评审,审稿周期大约20-30天。如果文章需修改,修改稿将再次提交评审。

Paper Template-文章模板

The papers should adhere to the Template! Author can choose from the abstract templates listed as follows:
文章需按模板排版。作者可根据自身需求选择一下模板:

1) Abstract Template for Oral Presentation

2) Abstract Template for Poster Presentation

3) Full Paper Template (Microsoft Word)

Important Dates-重要日期

Abstract Submission Deadline: May 20, 2020
摘要截稿日期

Full Paper Submission Deadline: May 25, 2020
全文截稿日期:

Notification of Acceptance: June 25, 2020
通知日期

Registration Deadline: July 25, 2020
注册截止日期

Collect from 网页模板

ABout us

2020 International Conference on Industrial Applications of Big Data and Artificial Intelligence (BDAI 2020) will be held in Shenzhen, China during Nov. 26-29, 2020, which is organized by Hong Kong Society of Mechanical Engineers(HKSME).We warmly welcome prospective authors to submit your research papers to BDAI 2020, and share your latest research results and valuable experiences with other top-scientists, engineers and scholars from all over the world.

Read More

01.

Registration Document 注册文件

After recevied notification, authors need to download and complete the Registration Form, then, send your final papers , filled registration form and the scanned payment proof to us.
收到文章录用通知书后,作者需下载并填写会议注册表,然后将文章终稿,填写好的注册表以及付款凭证等注册资料发送到会议邮箱。
1) Registration Form (English Version)

2) 中文注册表

02.

Programes Overeview 议程预览

Nov. 26, 2020-Registration and Conference kits collection 签到,领取会议资料

Nov. 27, 2020-Opening Remark + Plenary Lectures + Technical Sessions 开幕式+ 大会报告+ 主题研讨会

Nov.28, 2020-Invited Speech + Technical Sessions 特邀报告+ 主题研讨会

Nov.29, 2020-Techinal Tour 学术参观

03.

LATEST NEWS 最新资讯

BDAI 2020 is now accepting manuscript submissions. Prospective authors are invited to submit their draft paper to electronic contribution system. BDAI 2020 现面向广大学者公开征集稿件(征文主题详见),欢迎广大学者踊跃投稿!

BDAI 2020 will be held in Shenzhen, China during Nov. 26-29, 2020! 2020年大数据与人工智能产业应用国际会议将于2020年11月26日-29日在中国深圳召开!

BDAI 2019 was successfully be held in Shanghai during Oct. 18-20, 2019! BDAI 2019 已成功于2019年10月18日至20日在中国上海召开。

04.

Call for Participants

We warmly welcome prospective authors to submit their new research or technological contributions to AMRMT 2020, for sharing valuable experiences with scientists and students from around the world. You can join the conference as author, presenter and listener

05.

Conference Venue 会议地址

BDAI 2020 will be held in Shenzhen, China
BDAI 2020 将在中国深圳召开。

06.

Joined Conference 联合会议

2020 International Workshop on Smart City and Intelligent Systems (WSCIS 2020)
2020年智能城市与智能系统国际研讨会

Copyright © 2015.Company name All rights reserved.More Templates 模板之家 - Collect from 网页模板